<tr></tr>

  • <address id="NRouZ4"></address>

  • <dl><small></small></dl>

  • <tt><del></del></tt>

    <td id="NRouZ4"></td>

        1. UL /IEC/ EN 60950 Test Probe Kits BND-TPK01

          Product Description:UL /IEC/ EN 60950 IEC61032 Test Probe KitsModel:BND-TPK01Product Details:The BND-TPK-01 contains the devices listed in the core of the UL / IEC / EN 60950 requirements. It includes the following:· IEC Jointed Finger Probe (w/ banana jack in handle) (BND-B)· 50mm Impact Test Ball (BND-G500R)
          Description

          Product Description:

          UL /IEC/ EN 60950 IEC61032 Test Probe Kits

          Model:BND-TPK01


          Product Details:

          The BND-TPK-01 contains the devices listed in the core of the UL / IEC / EN 60950 requirements. It includes the following:

          · IEC Jointed Finger Probe (w/ banana jack in handle) (BND-B)

          · 50mm Impact Test Ball (BND-G500R)

          · Test Pin Probe: short (BND-13)

          · Rigid Finger Probe (BND-11)

          · Ball Pressure Tester (BND-QY102)

          · Telecom Test Probe (BND-TB12)

          Meets Requirements for Testing Standard(s) including but not limited to:IEC 60950EN 60950UL 60950CSA 950


          Datasheets of BND-TPK01 test probe kit:


          test probe B 1.jpgIEC61032  IEC60950  IEC60335
          IEC60529  IEC60045  IEC60884
          IEC60745
          Knurled Finger Diameter:12mm
          Knurled Finger Length:80mm
          Baffle Plate Diameter:50mm
          Baffle Plate Length:100mm
          Baffle Thickness:20mm
          BND-G500R
          Test Sphere 500G with ring
           2.jpgIEC61032  IEC60529Diameter:50mm
          Weight:227g
          BND-13
          Short Test Pin
           3.jpgIEC60065
          IEC60335
          IEC61032
          The probe Diameter:Head 3mm Tail 4mm
          The probe Length:15mm
          Dam-board Diameter:25mm
          Dam-board Thickness:4mm
          BND-11
          Rigid Test Probe 11
           4.jpgIEC61032
          IEC60065
          IEC60335
          IEC60884
          Nodular Finger Length:80mm
          Nodular Finger Diameter:12mm
          Dam-board Diameter:50mm
          Dan-board Thickness:5mm
          BND-TB12
          12mm Telecom Test Probe
           5.jpgIEC60065 IEC60695 IEC60950Probe Diameter:12mm
          Probe Length:80mm
          Baffle Plate Diameter:50mm
          BND-QY102
          Ball Pressure Apparatus
           6.jpgIEC60695-10-2 IEC60884
          IEC60320 IEC60335
          IEC60598
          IEC60950
          Ball diameter:5MM
          Total test pressure:20N±0.2N
          Samples bearing Diameter:50mm,Length:100mm Solid stainless steel cylinder



          20240625143359_26589 (1).jpg

          JbXNf

          <tr></tr>

        2. <address id="NRouZ4"></address>

        3. <dl><small></small></dl>

        4. <tt><del></del></tt>

          <td id="NRouZ4"></td>